Manufacturing of electronic parts are often part of a high volume automated process. UV spot curing provides a high speed, repeatable assembly process for high volume manufacturing. EXFO UV systems are designed to be easily integrated into an automated process.

EXFO UV spot curing products can be used when bonding a variety of plastics, stainless steel, glass, rubber & similar or dissimilar substrates, for electronics applications such as:

• Automotive Electronics
• Cell Phone Camera Assembly
• Digital Projectors Assembly
• Display Assembly
• Optical Data Storage
• Bonding
• Cables
• Coatings
• Component Marking or Staking
• Computer Chips
• Conformal Coating Rework
• Die Attach
• Disk Drives
• Display panels

• Displays
• Electronic Components
• Electroluminescent Displays
• Encapsulation
• Ferrite Magnet Bonding
• Field Emission Displays
• Flip Chips
• Flex Circuit Reinforcement/Relief
• Glob Tops
• Ink on Wires
• Light Emitting Diode Displays (LEDs)
• Liquid Crystal Displays
• Motors
• PDAs

• Pins
• Pin Attachments
• Plasma Displays
• Potting
• Printed Circuit Boards
• Ribbon Cables
• Sealing/Gasketing
• Smart Cards
• Speakers
• Strain Relief
• Surface Mount
• Temporary Masking
• Vacuum Fluorescent Displays
• Video Tape Recorder
• Wire Tacking