25th EXFO LSI

OmniCure


Electronics

Bonding in optical data storage requires high power, automation and high throughput. EXFO spot curing products have experience in read or read/write head assembly, flex circuit bonding/tacking, PC board applications, head gimbal assembly and bearing retention.

Features Benefits
  • Closed-Loop Feedback
  • Ensures repeatable manufacturing process with very high yields
  • Specific irradiance levels can be set
  • Minimizes heating and allows precise control
  • R2000 Radiometer used to calibrate the OmniCure® Series 2000
  • All UV curing systems can be easily set to the same irradiance level resulting in a reproducible process across production lines
  • Multi-legged High Power Fiber Light Guides provides equal irradiance to each leg
  • Ensures equal curing to multiple cure sites
  • The OmniCure® Series 2000 system includes two I/O ports and RS-232 communication for controlling the system remotely
  • The curing system can be easily integrated into an automated system minimizing development time

 

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